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tqp3m90 2 8 high linearity lna gain block data sheet: rev c 05 - 24 - 11 - 1 of 11 - disclaimer: subject to change without notice ? 20 1 0 triquint semiconductor, inc. connecting the digital world to the global network ? appli cations sot - 89 package ? repeaters ? mobile infrastructure ? defense/aerospace ? lte / wcdma / edge / cdma ? general purpose wireless ? if amplifier, rf driver amplifier product features functional block diagram ? 50- 4000 mhz ? flat gain (14.7 0.3 db) from 0.5 ? 3.5 ghz ? + 40 dbm output ip3 ? 2 db noise figure @ 1.9 ghz ? no rf component needed; 50 ? gain block ? unconditionally stable ? +5v single supply, 85 ma current ? sot - 89 package rf in gnd rf out gnd 1 2 3 4 general description pin configuration the tqp3m90 2 8 is a casca dable, high linearity gain block amplifier in a low - cost surface - mount package. at 1.9 ghz, the amplifier typically provides 14.7 db gain, + 40 dbm oip3, and 2 db noise figure while only drawing 85 ma current. the device is housed in a leadfree/green/rohs -c ompliant industry - standard sot - 89 package. the tqp3m90 2 8 has the benefit of having excellent gain flatness across a broad range of frequencies. th e low noise figure and high linearity performance allows the device to be used in both receiver and transmitt er chains for high performance systems. the amplifier is internally matched using a high performance e - phemt process and only requires an e xternal rf choke and blocking/ bypass capacitors for operation from a single +5v supply. the internal active bias circ uit also enables stable operation over bias and temperature variations. the tqp3m90 2 8 covers the 0.05- 4 ghz frequency band and is targeted for wireless infrastructure or other applications requiring high linearity and/ or low noise figure. ordering i nfo rmation part no. description tqp3m90 2 8 high linearity lna gain block tqp3m90 2 8 - pcb _if tqp3m90 2 8 e vb 0.05 - 0.5 ghz tqp3m90 2 8 - pcb_rf tqp3m90 2 8 e vb 0.5 - 4 ghz standard t/r size = 1000 pieces on a 7? reel. pin # symbol 1 rf input 3 rf output / v dd 2, 4 ground
tqp3m90 2 8 high linearity lna gain block data sheet: rev c 05 - 24 - 11 - 2 of 11 - disclaimer: subject to change without notice ? 20 1 0 triquint semiconductor, inc. connecting the digital world to the global network ? specifications absolute maximum ratings parameter rating storage temperature -65 to +150 o c rf input power, cw, 50 , t = 25oc +23 dbm device voltage,v dd +7 v reverse device voltage - 0.3v operation of this device outside the parameter ranges given above may cause permanent damage. recommended operating conditions parameter min typ max unit s v dd +4.75 +5 +5.25 v t case -40 85 o c tj (for > 10 6 hours mttf ) 190 o c electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommended operating conditions. electrical specifications test conditions unless otherwise noted: +25 oc, + 5 v vsupply, 50 system. parameter conditions min typical max unit s operational frequency range 50 4000 mhz test frequency 1900 mhz gain 13 14. 5 16 db input return loss 18 db output return loss 19 db output p1db + 20.7 dbm output ip3 see note 1 . + 36 + 40 db m noise figure 2 db v dd + 5 v current, i dd 85 100 ma thermal resistance (j nc to case) jc 36.6 o c/w notes 1. oip3 measured with two tones at an output power of + 4 dbm / tone separated by 1 mhz. the suppression on the largest im3 produc t is used to calculate the oip3 using 2:1 rule.
tqp3m90 2 8 high linearity lna gain block data sheet: rev c 05 - 24 - 11 - 3 of 11 - disclaimer: subject to change without notice ? 20 1 0 triquint semiconductor, inc. connecting the digital world to the global network ? device characterization v dd = +5 v, i dd = 85 ma, t = +25 c, calibrated to device leads freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 - 17.781 - 79. 977 16.426 168.24 - 19.626 4.3045 - 19.22 0 - 103.67 100 - 20.687 - 111.11 15.71 0 165.75 - 19.125 - 0.3832 - 19.244 - 133.67 200 - 23.728 - 139.82 15.333 161.88 - 18.801 - 5.7231 - 19.718 - 156.97 400 - 26.055 - 167.83 15.114 150.42 - 19.148 - 15.433 - 20.556 179.38 600 - 2 7.432 - 174.22 15.068 138.49 - 19.086 - 24.01 0 - 22.047 170.39 800 - 28.336 175.58 14.97 0 124.69 - 19.086 - 32.722 - 22.058 163.66 1000 - 28.09 0 168.62 14.889 112 .00 - 19.259 - 42.486 - 23.024 152.72 1200 - 27.851 173.63 14.837 98.392 - 19.196 - 50.978 - 24.702 147.54 1400 - 27.744 - 176.1 14.787 85.391 - 19.461 - 59.544 - 27.618 150.45 1600 - 25.498 - 170.21 14.785 71.784 - 19.643 - 67.665 - 30.371 178.07 1800 - 23.299 - 171.85 14.681 58.795 - 19.718 - 76.829 - 30.117 - 137.55 2000 - 21.873 - 177.68 14.742 45.335 - 19.786 - 86.241 - 24 .898 - 137.73 2200 - 19.991 174.69 14.585 31.38 0 - 20.202 - 94.784 - 21.473 - 136.81 2400 - 18.395 168.24 14.66 0 17.73 0 - 20.964 - 105.89 - 18.57 0 - 137.28 2600 - 16.954 156.32 14.54 0 3.3697 - 20.584 - 113.76 - 16.815 - 144.2 0 2800 - 15.635 143.92 14.468 - 10.871 - 21.08 1 - 123.83 - 15.001 - 146.29 3000 - 14.526 132.69 14.39 0 - 25.665 - 21.17 0 - 134.66 - 13.63 0 - 160.04 3200 - 13.585 121.19 14.321 - 40.604 - 21.463 - 143.32 - 12.59 0 - 169.39 3400 - 13.396 109.54 14.295 - 55.994 - 21.608 - 153.1 0 - 11.447 - 179.44 3600 - 13.267 95.204 14.10 3 - 71.813 - 22.114 - 164.82 - 10.288 168.78 3800 - 13.49 0 73.954 14.022 - 88.474 - 22.248 - 174.45 - 9.8699 161.57 4000 - 13.58 0 51.354 13.694 - 105.82 - 22.604 175.38 - 9.6061 156.49
tqp3m90 2 8 high linearity lna gain block data sheet: rev c 05 - 24 - 11 - 4 of 11 - disclaimer: subject to change without notice ? 20 1 0 triquint semiconductor, inc. connecting the digital world to the global network ? application circuit configuration bill of material reference designation frequency (mhz) tqp3m90 2 8 - pcb_if tqp3m90 2 8 - pcb_rf 50 - 500 500 - 4000 q1 tqp3m90 28 c2, c6 1000 pf 100 pf c1 0.01 uf 0.01 uf l2 330 nh 68 nh l1, d1, c3, c4 do not place b1 0 notes: 1. performances can be optimized at frequency of interest by using recommended component values shown in the table below. reference designation frequency (mhz) 500 2000 2500 3500 c2, c6 100 pf 22 pf 22 pf 22 pf l2 82 nh 22 nh 18 nh 15 n h notes: 1. see pc board layout, page 9 for more information. 2. components shown on the silkscreen but not on the schematic are not used. 3. b1 (0 jumper) may be replaced with copper trace in the target application layout. 4. the recommended component values are dependent upon the frequency of operation. 5. all components are of 0603 size unless stated on the schematic. +5vdd
tqp3m90 2 8 high linearity lna gain block data sheet: rev c 05 - 24 - 11 - 5 of 11 - disclaimer: subject to change without notice ? 20 1 0 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance 500 - 4000 mhz test conditions unless otherwise noted: +25oc, +5v, 8 5 ma , 50 system. the data shown below is measured on tqp3m902 8- pcb_rf. notes: 1. oip3 measured with two tones at an output power of + 4 dbm / tone separated by 1 mhz. the suppression on the largest im3 product is us ed to calculate the oip3 using 2:1 rule. 2. noise figure data shown in the table above is measured on evaluation board which includes board losses of around 0.1db @ 2 ghz . rf performance plots 12 13 14 15 16 17 0.5 1 1.5 2 2.5 3 3.5 4 gain (db) frequency (ghz) gain vs. frequency over temp - 40 c +25 c +85 c - 40 - 30 - 20 - 10 0 0.5 1 1.5 2 2.5 3 3.5 4 s11 (db) frequency (ghz) s11 vs. frequency over temp +85 c +25 c - 40 c - 40 - 30 - 20 - 10 0 0.5 1 1.5 2 2.5 3 3.5 4 s22 (db) frequency (ghz) s22 vs. frequency over temp - 40 c +85 c +25 c 25 30 35 40 45 0 2 4 6 8 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone over freq +25 c, 1 mhz tone spacing 1.9 ghz 0.9 ghz 2.7 ghz 3.5 ghz frequency mhz 500 900 1900 2 7 00 3 5 00 40 00 gain db 15.2 15.1 14.7 14.4 14.6 14.2 input return loss db 19 24 18 16 17 12 output return loss db 17.5 21 19 14 16 1 6.5 output p1db dbm + 21.3 + 21.4 + 20.7 +19. 8 +19. 6 +18. 1 oip3 [1] dbm + 40.6 + 40.1 + 40.3 + 36.2 + 33.2 + 29 noise figure [2] db 1.8 2 2 2.5
tqp3m90 2 8 high linearity lna gain block data sheet: rev c 05 - 24 - 11 - 6 of 11 - disclaimer: subject to change without notice ? 20 1 0 triquint semiconductor, inc. connecting the digital world to the global network ? rf performance plots 25 30 35 40 45 0 2 4 6 8 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone over temp f=1900 mhz, 1 mhz tone spacing +25 c - 40 c +85 c 25 30 35 40 45 0.5 1 1.5 2 2.5 3 3.5 4 oip3 (dbm) frequency (ghz) oip3 vs. frequency over temp 1 mhz tone spacing, 4 dbm/tone - 40 c +25 c +85 c 16 18 20 22 24 0.5 1 1.5 2 2.5 3 3.5 4 p1db (dbm) frequency (ghz) p1db vs. frequency over temp - 40 c +25 c +85 c 0 1 2 3 4 0.5 1.0 1.5 2.0 2.5 3.0 nf (db) frequency (ghz) noise figure vs. frequency over temp +85 c +25 c ?40 c
tqp3m90 2 8 high linearity lna gain block data sheet: rev c 05 - 24 - 11 - 7 of 11 - disclaimer: subject to change without notice ? 20 1 0 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance 50 - 500 mhz test conditions unless otherwise noted: +25oc, +5v, 85 ma, 50 system. the data sho wn below is measured on tqp3m902 8- pcb_if. notes: 1. oip3 measured with two tones at an output power of + 6 dbm / tone separate d by 1 mhz. the suppression on the largest im3 product is used to calculate the oip3 using 2:1 rule. 2. noise figure data shown in the table above is measured on evaluation board which includes board losses of around 0.1 db @ 2 ghz . if performance plots 12 13 14 15 16 17 0 100 200 300 400 500 gain (db) frequency (mhz) gain vs. frequency over temp +85 c +25 c ?40 c - 30 - 25 - 20 - 15 - 10 - 5 0 0 100 200 300 400 500 s11 (db) frequency (mhz) s11 vs. frequency over temp +85 c +25 c ?40 c - 30 - 25 - 20 - 15 - 10 - 5 0 0 100 200 300 400 500 s22 (db) frequency (mhz) s22 vs. frequency over temp +85 c +25 c ?40 c 30 35 40 45 50 0 2 4 6 8 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone over frequency 1 mhz tone spacing, temp. = +25 c 100 mhz 200 mhz 300 mhz 400 mhz 500 mhz frequency mhz 7 0 1 00 2 00 5 00 gain db 15.8 15.5 15.3 15.2 input return loss db 13 15 20 25 output return loss db 23 23 22 20.5 output p1db dbm + 20.6 +20 .6 + 21.0 + 21.2 oip3 [1] dbm + 41.3 + 40.6 + 42.4 + 40.4 noise figure [2] db 1. 8 1. 7 1.7 1. 8
tqp3m90 2 8 high linearity lna gain block data sheet: rev c 05 - 24 - 11 - 8 of 11 - disclaimer: subject to change without notice ? 20 1 0 triquint semiconductor, inc. connecting the digital world to the global network ? 30 35 40 45 50 55 0 100 200 300 400 500 oip3 (dbm) frequency (mhz) oip3 vs.frequency over temperature output power /tone = +6dbm, 1 mhz tone spacing +85 c +25 c ?40 c 16 18 20 22 24 0 100 200 300 400 500 p1db (dbm) frequency (mhz) p1db vs. frequency over temperature +85 c +25 c ?40 c 0 1 2 3 4 0 100 200 300 400 500 nf (db) frequency (mhz) noise figure vs. frequency over temp +85 c +25 c ?40 c
tqp3m90 2 8 high linearity lna gain block data sheet: rev c 05 - 24 - 11 - 9 of 11 - disclaimer: subject to change without notice ? 20 1 0 triquint semiconductor, inc. connecting the digital world to the global network ? pin configuration and description rf in gnd rf out gnd 1 2 3 4 pin symbol description 1 rf in input, matched to 50 ohms . external dc block is required. 2, 4 gnd rf/dc ground connection 3 rfout / vdd output, matched to 50 ohms, externa l dc block is required and supply voltage applications information pc board layout top rf layer is .014? nelco n 4000 - 13, ? r = 3.9, 4 total layers (0.062? thick) for mechanical rigidity. metal layers are 1 - oz copper. 50 ohm microstrip line details: width = .0 29 ?, spacing = .0 35 ?. the pad pattern shown has been developed and tested for optimized assembly at triquin t semiconductor. the pcb land pattern has been developed to accommodate lead and p ackage tolerances. since sur face mount processes vary from supplier to supplier , careful process development is recommended.
tqp3m90 2 8 high linearity lna gain block data sheet: rev c 05 - 24 - 11 - 10 of 11 disclaimer: subject to change without notice ? 20 1 0 triquint semiconductor, inc. connecting the digital world to the global network ? mechanical information package infor mation and dimensions this package is lead - free/rohs - compliant. the plating materia l on the leads is nipdau. it is compatible with both lead - free (maximum 260 c reflow temperature) and lead (maximum 245 c reflow temperature) soldering processes. the co mpon ent will be marked with a ?3m902 8? designator with an alphanumeric lot code on the top surface of package. the ?y? represents the last digit of the year the part was manufactured; the ?xxx? is an auto generated number. mounting configuration all dimensions are in millimeters (inches). angles are in degrees. notes : 1. ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80 / .0135?) diamete r drill and have a final plated thru diameter of .25 mm (.010?). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. rf trace width depends upon the pc board material and construction. 4. use 1 oz. copper minimum. 3 m902 8 yxxx
tqp3m90 2 8 high linearity lna gain block data sheet: rev c 05 - 24 - 11 - 11 of 11 disclaimer: subject to change without notice ? 20 1 0 triquint semiconductor, inc. connecting the digital world to the global network ? pro duct compliance information esd information esd rating: class 1a value: passes 250v to < 500 v test: human body model (hbm) standard: jedec standard jesd22 - a114 esd rating: cdm class iv value: passes 1000 v test: charged device model (cdm) standard: jedec standard jesd22 -c101 solderability compatible with the latest version of j - std- 020, lead free solder, 260 this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electr ical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating level 3 at +260 c convection reflow the part is rated mo isture sensitivity level 3 at 260c per jedec standard ipc/jedec j - std - 020. contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information ab out triquint: web: www.triquint.com tel: +1.503.615.9000 email: info - sales@tqs.com fax: +1.503.615.8902 for technical questions and application information: email: sjcapplications.engineering@tqs.com important notice the information contained herein is believed to be reliable . triquint makes no warranties regarding the information contain ed herein . triquint assumes no responsi bility or liability whatsoever for any of the information contained her ein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and wit h all faults, and the entire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders f or triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual pro perty rights, whether with regard to such information it self or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life - saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.

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